thiXstrip® ThermoTIM™ High-Performance Thixotropic Additive for Thermal Interface Materials

thiXstrip® ThermoTIM™ is a premium thixotropic additive engineered to optimize the rheology and stability of thermal interface materials (TIMs) such as silicones, epoxies, and polyurethanes. Designed for formulators and manufacturers, this high-performance blend ensures your TIMs remain robust and free from filler sedimentation—enhancing both reliability and ease of processing.

Key Benefits

• Superior Thixotropy: Creates a stable, three-dimensional network structure, providing a “solid at rest, liquid under shear” behavior that prevents sag, runs, and particulate settling.
• Enhanced Processing: Increases viscosity and yield stress with customizable flow profiles, enabling precise application in vertical or complex geometries without dripping or slumping.
• Consistent Performance: Maintains uniform filler distribution for reliable thermal conductivity and improved product lifespan.
• Easy Integration: Compatible with common TIM matrices for epoxy, silicone, and polyurethane systems and disperses easily with standard high-shear mixing equipment.

Usage Scenarios

• Formulating thermal pastes, gap fillers, or potting compounds for electronics cooling
• Developing non-sag, high thermal conductivity adhesives for power modules and LEDs
• Preventing pigment or interface particle separation in advanced heat transfer materials

How It Works

This additive leverages a synergistic combination of tailored organoclays and advanced silica thixotropes that interact to deliver unmatched anti-settling power and rheological control. The result is superior batch-to-batch consistency and application confidence, even in highly filled systems.

Simple Application

1. Pre-wet the additive in a portion of your base resin or compatible solvent for 10–15 minutes to ensure full activation.
2. Add gradually to the main batch under high shear mixing for 10–20 minutes.
3. Optional: Apply a mild heat (up to 50°C if resin allows) to boost dispersion, then allow to rest for peak thixotropic effect.

Unlock optimal stability and workability in your thermal interface formulations with thiXstrip® ThermoTIM™—the trusted solution for modern electronics and advanced materials manufacturing.